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Micronnect is distributor of electronic packaging products in Europe. We sell products from DeWeyl, JFP Microtechnic, Coorstek-Gaiser, Coining, SPT, and West·Bond. Additionally we offer you consulting and equipment service, based on some 20 years of experience in electronic packaging.

We deliver:

  • Equipment for die and wire bonding, bond testing, flipchip bonding.
  • Tools for wire bonding: wedge tools, deep-access tools, capillaries.
  • Tools for die bonding.
  • Welding electrodes for parallel-gap welding.
  • Bonding wire and ribbon: gold, aluminum, copper, platinum, silver.
  • Stampings such as solder pre-forms, heat sinks, bond pads.

We provide:

  • Courses: bond qualification, design of experiments, theory.
  • Equipment instructions.
  • Equipment service.

Micronnect helps you to make your products yourself.

  • High Tech Campus 9
  • 5656 AE
  • Eindhoven
  • +31 - (0)40 294 02 65
  • Email
  • Website

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