Micronnect is distributor of electronic packaging products in Europe. We sell products from DeWeyl, JFP Microtechnic, Coorstek-Gaiser, Coining, SPT, and West·Bond. Additionally we offer you consulting and equipment service, based on some 20 years of experience in electronic packaging.
- Equipment for die and wire bonding, bond testing, flipchip bonding.
- Tools for wire bonding: wedge tools, deep-access tools, capillaries.
- Tools for die bonding.
- Welding electrodes for parallel-gap welding.
- Bonding wire and ribbon: gold, aluminum, copper, platinum, silver.
- Stampings such as solder pre-forms, heat sinks, bond pads.
- Courses: bond qualification, design of experiments, theory.
- Equipment instructions.
- Equipment service.
Micronnect helps you to make your products yourself.
- High Tech Campus 9
- 5656 AE
- +31 - (0)40 294 02 65